XC7Z030-1FBG676C
AMD Xilinx
XC7Z030-1FBG676C
AMD Xilinx
IC SOC CORTEX-A9 667MHZ 676FCBGA
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$289.90000
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$287.001
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$284.102
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$281.203
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$278.304
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$275.405
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XC7Z030-1FBG676C
$289.90
Product details
Engineered for next-generation automotive electronics, AMD Xilinx's XC7Z030-1FBG676C redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making XC7Z030-1FBG676C the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 667MHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.Kintex™-7 FPGA, 125K Logic Cells include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 85°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 676-BBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 676-FCBGA (27x27), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
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