XC7Z007S-2CLG225E
AMD Xilinx
XC7Z007S-2CLG225E
AMD Xilinx
IC SOC CORTEX-A9 766MHZ 225BGA
Reference Price (USD)
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$61.50000
500+
$60.885
1000+
$60.27
1500+
$59.655
2000+
$59.04
2500+
$58.425
Exquisite packaging
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XC7Z007S-2CLG225E
$61.50
Product details
Engineered for next-generation automotive electronics, AMD Xilinx's XC7Z007S-2CLG225E redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making XC7Z007S-2CLG225E the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Single ARM® Cortex®-A9 MPCore™ with CoreSight™, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 766MHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.Artix™-7 FPGA, 23K Logic Cells include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for 0°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 225-LFBGA, CSPBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 225-CSPBGA (13x13), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 766MHz
- Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 225-LFBGA, CSPBGA
- Supplier Device Package: 225-CSPBGA (13x13)
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