XC7S75-1FGGA676C
AMD Xilinx
        
                                XC7S75-1FGGA676C                            
                        
                                AMD Xilinx                            
                        
                                IC FPGA 400 I/O 676FPBGA                            
                        Reference Price (USD)
1+
                                            $94.09500
                                        500+
                                            $93.15405
                                        1000+
                                            $92.2131
                                        1500+
                                            $91.27215
                                        2000+
                                            $90.3312
                                        2500+
                                            $89.39025
                                        Exquisite packaging
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                            Product details
                    The XC7S75-1FGGA676C from AMD Xilinx delivers military-grade reliability in Embedded - FPGAs (Field Programmable Gate Array), developed for aerospace and defense applications. This radiation-tolerant FPGA combines high-speed processing with configurable security features, making it ideal for secure communications and electronic warfare systems. The architecture includes tamper-resistant design elements while maintaining full observability for system diagnostics.Organized into 6000 radiation-hardened logic blocks, the architecture supports triple modular redundancy designs. Each CLB includes voting logic for single-event transient mitigation in space applications.With 76800 radiation-hardened logic cells, the device implements complex encryption algorithms with deterministic latency. The cell architecture includes single-event upset mitigation techniques without compromising routing flexibility.The 4331520 bits of secure memory incorporate physical unclonable functions for device authentication. The memory subsystem implements parity protection with real-time error logging for system health monitoring.The 400 military-spec I/Os include EMP hardening and support differential signaling up to 12.5Gbps. Each I/O bank can be configured for TEMPEST-compliant emissions control in sensitive intelligence applications.Operating from 0.95V ~ 1.05V, the power delivery network includes redundant regulators for fault tolerance. The adaptive voltage scaling maintains optimal performance while minimizing thermal signatures in covert deployments.The Surface Mount package meets MIL-STD-883 shock and vibration requirements while providing excellent thermal conduction. The hermetic sealing prevents moisture ingress in high-altitude or maritime environments.Qualified for 0°C ~ 85°C (TJ) operation, the device maintains full functionality across extreme environmental conditions. The thermal management system prevents performance throttling during sustained high-compute workloads.The 676-BGA package implements gold-plated contacts for corrosion resistance in harsh environments. The ceramic substrate provides excellent alpha particle shielding for space applications.Supplied in 676-FPBGA (27x27) configuration, the device includes full traceability documentation required for defense contracts. The packaging meets ESD protection standards for sensitive military components.                
                Product Attributes
- Product Status: Active
 - Number of LABs/CLBs: 6000
 - Number of Logic Elements/Cells: 76800
 - Total RAM Bits: 4331520
 - Number of I/O: 400
 - Number of Gates: -
 - Voltage - Supply: 0.95V ~ 1.05V
 - Mounting Type: Surface Mount
 - Operating Temperature: 0°C ~ 85°C (TJ)
 - Package / Case: 676-BGA
 - Supplier Device Package: 676-FPBGA (27x27)
 

