XC7S75-1FGGA676C
AMD Xilinx
XC7S75-1FGGA676C
AMD Xilinx
IC FPGA 400 I/O 676FPBGA
Reference Price (USD)
1+
$94.09500
500+
$93.15405
1000+
$92.2131
1500+
$91.27215
2000+
$90.3312
2500+
$89.39025
Exquisite packaging
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Product details
The XC7S75-1FGGA676C from AMD Xilinx delivers military-grade reliability in Embedded - FPGAs (Field Programmable Gate Array), developed for aerospace and defense applications. This radiation-tolerant FPGA combines high-speed processing with configurable security features, making it ideal for secure communications and electronic warfare systems. The architecture includes tamper-resistant design elements while maintaining full observability for system diagnostics.Organized into 6000 radiation-hardened logic blocks, the architecture supports triple modular redundancy designs. Each CLB includes voting logic for single-event transient mitigation in space applications.With 76800 radiation-hardened logic cells, the device implements complex encryption algorithms with deterministic latency. The cell architecture includes single-event upset mitigation techniques without compromising routing flexibility.The 4331520 bits of secure memory incorporate physical unclonable functions for device authentication. The memory subsystem implements parity protection with real-time error logging for system health monitoring.The 400 military-spec I/Os include EMP hardening and support differential signaling up to 12.5Gbps. Each I/O bank can be configured for TEMPEST-compliant emissions control in sensitive intelligence applications.Operating from 0.95V ~ 1.05V, the power delivery network includes redundant regulators for fault tolerance. The adaptive voltage scaling maintains optimal performance while minimizing thermal signatures in covert deployments.The Surface Mount package meets MIL-STD-883 shock and vibration requirements while providing excellent thermal conduction. The hermetic sealing prevents moisture ingress in high-altitude or maritime environments.Qualified for 0°C ~ 85°C (TJ) operation, the device maintains full functionality across extreme environmental conditions. The thermal management system prevents performance throttling during sustained high-compute workloads.The 676-BGA package implements gold-plated contacts for corrosion resistance in harsh environments. The ceramic substrate provides excellent alpha particle shielding for space applications.Supplied in 676-FPBGA (27x27) configuration, the device includes full traceability documentation required for defense contracts. The packaging meets ESD protection standards for sensitive military components.
Product Attributes
- Product Status: Active
- Number of LABs/CLBs: 6000
- Number of Logic Elements/Cells: 76800
- Total RAM Bits: 4331520
- Number of I/O: 400
- Number of Gates: -
- Voltage - Supply: 0.95V ~ 1.05V
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FPBGA (27x27)