XC3S5000-4FG900I

Designed for next-generation automotive electronics, AMD Xilinx's XC3S5000-4FG900I sets new standards in Embedded - FPGAs (Field Programmable Gate Array) for reliability and performance. This radiation-hardened FPGA meets stringent automotive qualification requirements while delivering the computational power needed for autonomous driving subsystems. The architecture incorporates triple-redundant voting logic and SEU-resistant memory for functional safety applications.The 8320 logic array blocks are arranged in fault-tolerant triplets for safety-critical applications. Each CLB includes mismatch detection circuits that flag potential soft errors before they affect system operation.The 74880 logic cell matrix provides ample resources for implementing ASIL-D compliant safety mechanisms. The symmetrical cell distribution ensures balanced routing delays critical for fault detection circuits.With 1916928 bits of protected memory, the device can buffer multiple sensor data streams simultaneously. The ECC-protected memory architecture detects and corrects transient errors caused by automotive electrical noise environments.The 633 automotive-grade I/Os support 12V fault tolerance and include built-in current limiting. Each I/O bank can be independently configured for LIN/CAN FD/FlexRay interface protocols common in vehicle networks.The 5000000 equivalent gate count provides sufficient resources for implementing complex sensor fusion algorithms. The hardened multipliers and accumulators accelerate matrix operations common in machine vision processing.Operating from 1.14V ~ 1.26V, the power architecture includes load-dump protection and reverse polarity safeguards. The adaptive body biasing technique reduces leakage current during extended vehicle standby periods.The Surface Mount package meets automotive vibration specifications while maintaining reliable connections under thermal cycling. The solder joint design has been optimized for lead-free assembly processes required in modern vehicle electronics.Qualified for -40°C ~ 100°C (TJ) operation, the device maintains timing margins across the full automotive temperature range. The thermal shutdown circuitry prevents damage during extended exposure to under-hood conditions.The 900-BBGA package incorporates copper heat spreaders for efficient thermal management in confined automotive modules. The mold compound has been formulated for resistance to automotive fluids and cleaning agents.Supplied in 900-FBGA (31x31) configuration, the device includes automotive-grade moisture sensitivity labeling. The tape-and-reel packaging complies with automated assembly requirements for high-volume vehicle production.