XC3S1500-5FGG676C

AMD Xilinx's XC3S1500-5FGG676C revolutionizes medical imaging systems within Embedded - FPGAs (Field Programmable Gate Array), precision-engineered for diagnostic equipment and patient monitoring. This low-power FPGA delivers the analog front-end processing capabilities needed for high-resolution ultrasound and digital X-ray systems. The architecture includes specialized DSP blocks for real-time image reconstruction while maintaining strict electromagnetic compatibility requirements.Organized into 3328 configurable logic blocks, the architecture supports pipelined processing of high-bandwidth sensor data. Each CLB includes precision timing resources for synchronous data acquisition across multiple channels.The 29952 logic elements provide sufficient resources for parallel processing of multiple sensor channels. The symmetrical cell distribution minimizes clock skew in time-critical signal acquisition paths.With 589824 bits of low-noise memory, the device buffers high-resolution image frames without artifacts. The memory architecture implements error detection circuits that meet medical device safety standards.The 487 low-noise analog-capable I/Os support direct sensor interfacing with 24-bit resolution. Each I/O bank includes programmable filtering for noise reduction in sensitive biopotential measurements.The 1500000 equivalent gate count enables implementation of complex image processing pipelines with real-time constraints. The specialized DSP blocks accelerate Fourier transforms for ultrasound beamforming applications.Operating from 1.14V ~ 1.26V, the power management system achieves ultra-low noise performance required for medical imaging. The isolated power domains prevent digital switching noise from affecting analog signal chains.The Surface Mount package configuration facilitates thermal management in enclosed medical equipment. The lead-free package material complies with RoHS and REACH environmental regulations.Rated for 0°C ~ 85°C (TJ) operation, the device maintains precision analog characteristics across clinical environment conditions. The thermal compensation circuits ensure measurement accuracy during prolonged imaging sessions.The 676-BGA package design minimizes parasitic capacitance for high-impedance sensor interfaces. The material selection has been optimized for biocompatibility in implantable applications.Available in 676-FBGA (27x27) format, the device meets medical sterilization requirements for operating room equipment. The packaging includes unique device identifiers for medical device tracking.