XA7Z010-1CLG225I
AMD Xilinx
XA7Z010-1CLG225I
AMD Xilinx
IC SOC CORTEX A-9 ZYNQ7 225BGA
Reference Price (USD)
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$71.40150
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$70.687485
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$69.97347
1500+
$69.259455
2000+
$68.54544
2500+
$67.831425
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XA7Z010-1CLG225I
$71.40
Product details
Engineered for next-generation automotive electronics, AMD Xilinx's XA7Z010-1CLG225I redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making XA7Z010-1CLG225I the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MCU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.With 256KB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.Operating at 667MHz, the processor meets the real-time processing requirements of high-resolution radar and lidar systems.Artix™-7 FPGA, 28K Logic Cells include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for -40°C ~ 100°C (TJ), the component maintains precise timing references across the full automotive temperature range.The 225-LFBGA, CSPBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 225-CSPBGA (13x13), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- Flash Size: -
- RAM Size: 256KB
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Speed: 667MHz
- Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 225-LFBGA, CSPBGA
- Supplier Device Package: 225-CSPBGA (13x13)
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