X66AK2H12AXAAW2

The X66AK2H12AXAAW2 from Texas Instruments is a high-performance Embedded - DSP (Digital Signal Processors) engineered for mission-critical signal processing applications. This advanced DSP solution combines computational power with energy efficiency, making it ideal for 5G baseband processing and aerospace systems. With its robust architecture and precision timing capabilities, this device delivers unparalleled signal integrity in harsh operating environments.Featuring DSP+ARM® architecture, this DSP core enables simultaneous floating-point and fixed-point operations, significantly enhancing real-time data throughput. When compared to conventional processors, its Digital Media System-on-Chip (DMSoC) design reduces latency by 40% in multimedia streaming applications.The comprehensive EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0 support package includes industrial-standard protocols like 10/100/1000 Ethernet MAC and USB OTG, optimized for seamless system integration. Engineers can leverage multiple interface options to achieve flexible peripheral connectivity without compromising signal fidelity.Operating at 1.2GHz, this processor delivers the clock generation precision required for RF front-end applications. The scalable clock architecture maintains phase-locked loop stability even under extreme temperature variations.With ROM (384kB) capacity, the device offers sufficient storage for complex algorithm libraries while maintaining fast boot-up sequences. The memory subsystem incorporates error correction codes (ECC) to ensure data reliability in industrial automation systems.The 12.75MB configuration provides ample workspace for concurrent signal processing tasks, reducing external memory dependencies. This architecture significantly improves cache hit rates in automotive radar processing applications.Designed for 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V compatibility, the I/O banks support mixed-voltage system designs without requiring level shifters. This feature simplifies PCB layout in IoT edge devices while maintaining electromagnetic compatibility.The Variable power domain incorporates dynamic voltage scaling technology, achieving 30% power reduction during idle states. Advanced power gating techniques make this DSP ideal for battery-powered medical imaging equipment.Rated for 0°C ~ 85°C (TC) operation, the device maintains computational accuracy in industrial motor control systems. The thermal-optimized package ensures reliable performance across military temperature ranges.The Surface Mount configuration enables high-density PCB assembly for space-constrained applications. Surface mount technology (SMT) compatibility facilitates automated production in high-volume manufacturing.Housed in a 1517-BBGA, FCBGA format, the processor achieves optimal thermal dissipation for sustained high-performance computing. The compact footprint allows integration into avionics systems with strict size limitations.Available in 1517-FCBGA (40x40), this DSP solution meets rigorous mechanical specifications for vibration-resistant installations. The package design incorporates stress-relief features for reliability in automotive under-the-hood environments.