X66AK2H12AAWA2

Texas Instruments's X66AK2H12AAWA2 delivers cutting-edge Embedded - DSP (Digital Signal Processors) performance for aerospace and defense applications. This ruggedized DSP solution combines radiation hardness with cryptographic acceleration, making it ideal for satellite communications and avionics signal processing.The DSP+ARM® architecture incorporates radiation-hardened by design (RHBD) techniques for space applications. Its SC140 Core configuration provides the fault-tolerant computing required for orbital navigation systems.Military-grade EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0 implementation includes radiation-tolerant SERDES links for space data buses. The interface subsystem incorporates triple modular redundancy for single-event upset (SEU) protection.Operating at 1.2GHz, the processor meets the timing requirements of phased array radar systems. The radiation-hardened PLL maintains clock stability in high-altitude environments.The ROM (384kB) subsystem employs SEE mitigation techniques for spaceborne applications. Error-correcting codes protect configuration data from cosmic ray-induced bit flips.With 12.75MB capacity, the DSP handles multiple radar channels in airborne early warning systems. The memory incorporates scrubber circuits for continuous error correction.The 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V implementation supports military power supply variations in field-deployed equipment. The I/O cells include EMP hardening for electromagnetic pulse protection.The Variable domain implements fault-tolerant power sequencing for aerospace systems. Redundant voltage monitors ensure reliable operation during power transients.Qualified for -40°C ~ 100°C (TC), the device operates reliably in satellite thermal environments. The extended temperature testing includes orbital thermal cycling profiles.The Surface Mount configuration meets military PCB assembly standards for high-reliability applications. The package design prevents tin whisker growth in long-duration missions.Housed in 1517-BBGA, FCBGA, the processor meets outgassing requirements for vacuum operation. The package materials are compliant with NASA low-outgassing specifications.Available in 1517-FCBGA (40x40), this space-qualified DSP undergoes MIL-STD-883 testing. The package includes lot traceability and radiation test data for space programs.