X2000
Lumissil Microsystems
X2000
Lumissil Microsystems
MULTI-CPU HETEROGENEOUS MULTI-AP
Reference Price (USD)
1+
$17.49000
500+
$17.3151
1000+
$17.1402
1500+
$16.9653
2000+
$16.7904
2500+
$16.6155
Exquisite packaging
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X2000
$17.49
Product details
The X2000 by Lumissil Microsystems establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a XBurst® 2 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.Operating at 1.2GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The LPDDR3 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting DVP, LCD, MIPI-CSI, MIPI-DSI outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100/1000Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 OTG (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented AES, RSA, TRNG, MD5, SHA, SHA2 include model encryption and secure model update mechanisms for protected edge AI deployments.The 270-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 270-BGA (12x12), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: XBurst® 2
- Number of Cores/Bus Width: -
- Speed: 1.2GHz
- Co-Processors/DSP: -
- RAM Controllers: LPDDR3
- Graphics Acceleration: No
- Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
- Ethernet: 10/100/1000Mbps (1)
- SATA: -
- USB: USB 2.0 OTG (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
- Package / Case: 270-LFBGA
- Supplier Device Package: 270-BGA (12x12)
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