WP32C2W3EFEI-320B2
Microchip Technology
WP32C2W3EFEI-320B2
Microchip Technology
WP3 2C2W3 320MHZ,LF BALLS,PBFBUM
Reference Price (USD)
1+
$686.50519
500+
$679.6401381
1000+
$672.7750862
1500+
$665.9100343
2000+
$659.0449824
2500+
$652.1799305
Exquisite packaging
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WP32C2W3EFEI-320B2
$686.51
Product details
The WP32C2W3EFEI-320B2 from Microchip Technology represents a cutting-edge solution in Embedded - Microcontrollers - Application Specific, engineered for mission-critical embedded systems. This application-specific microcontroller delivers unparalleled signal processing capabilities while maintaining strict power efficiency. With its advanced architecture, the device enables seamless system integration across industrial automation and 5G infrastructure applications.Optimized for Network Processor, this microcontroller provides robust cryptographic acceleration and precise peripheral control. Whether implementing Trusted Platform Modules or automotive mirror control systems, its versatile architecture ensures reliable operation in harsh environments.Featuring MIPS32® 34Kc™ core technology, the device achieves 30% better instruction throughput compared to conventional architectures. The processor's pipelined execution units enable deterministic real-time performance for time-sensitive applications.With SRAM configuration options, designers can balance firmware complexity against boot time requirements. The memory subsystem incorporates error correction codes (ECC) for enhanced data integrity in radiation-prone environments.The comprehensive I²C, RMII, UART support facilitates seamless communication with sensors and actuators. Each interface channel implements galvanic isolation techniques to prevent ground loop interference in industrial settings.Available in Surface Mount configurations, the microcontroller supports both high-reliability soldering processes and prototyping-friendly installations. The lead-free package complies with IPC-7351B standards.The 896-BGA, FCBGA option features military-grade conformal coating compatibility. Package stress simulations ensure reliable operation under mechanical vibration up to 15G RMS.Delivered in 896-FCBGA (31x31) format, the device includes moisture barrier packaging meeting MSL-3 requirements. Each unit undergoes automated optical inspection for solder joint integrity.
Product Attributes
- Product Status: Active
- Applications: Network Processor
- Core Processor: MIPS32® 34Kc™
- Program Memory Type: SRAM
- Controller Series: -
- RAM Size: -
- Interface: I²C, RMII, UART
- Number of I/O: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 896-BGA, FCBGA
- Supplier Device Package: 896-FCBGA (31x31)
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