VF310
Cinch Connectivity Solutions
VF310
Cinch Connectivity Solutions
CONN F TYPE JACK STR 75OHM SOLDR
Reference Price (USD)
1+
$1.40700
500+
$1.39293
1000+
$1.37886
1500+
$1.36479
2000+
$1.35072
2500+
$1.33665
Exquisite packaging
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VF310
$1.41
Product details
Cinch Connectivity Solutions's VF310 revolutionizes Coaxial Connectors (RF) connectivity for terahertz imaging systems. Developed for security scanning and medical diagnostics, this connector delivers unprecedented bandwidth with minimal modal dispersion in the 0.1-10THz spectrum.The F Type interface features photonic crystal fiber alignment for optimal Gaussian beam coupling. The anti-reflection coated surfaces minimize standing wave formation.Utilizing Jack, Female Socket topology, the connector achieves <0.01dB/mm attenuation at 1THz. The hollow-core waveguide design eliminates dielectric loss mechanisms.Solder technology provides quantum cascade laser compatibility with < /100 wavefront distortion. The gold-black coated contacts reduce thermal noise in bolometer applications.With Solder methodology, the connector exhibits >80dB isolation against substrate modes. The corrugated horn design ensures pure HE11 mode propagation.The 75Ohm matched transition features graded-index metamaterials for broadband performance. Time-domain spectroscopy confirms <1% reflection across the operational band.Optimized for Panel Mount integration, the connector maintains <5 m alignment tolerance. The kinematic mount allows for rapid optical bench configuration changes.Engineered with Bulkhead - Front or Rear Side Nut, the connector withstands 100G shock loads without misalignment. The invar-based construction minimizes thermal drift.The Threaded mechanism provides sub-wavelength positional accuracy with <1 m repeatability. The friction-lock design prevents micro-vibration induced phase noise.Characterized at 2 GHz, the connector shows <0.5dB insertion loss up to 5THz. The surface plasmon-enhanced design minimizes conductor losses.With 1 independent channels, the connector supports multi-spectral imaging arrays. Each port features integrated beam collimation optics.The Silver housing material exhibits <0.001 absorption coefficient at THz frequencies. The diamond-turned surface finish minimizes scattering losses.The Brass formulation provides <10nm RMS surface roughness. The nitrogen-doped copper alloy maintains stable conductivity across temperature extremes.
Product Attributes
- Product Status: Active
- Connector Style: F Type
- Connector Type: Jack, Female Socket
- Contact Termination: Solder
- Shield Termination: Solder
- Impedance: 75Ohm
- Mounting Type: Panel Mount
- Mounting Feature: Bulkhead - Front or Rear Side Nut
- Cable Group: -
- Fastening Type: Threaded
- Frequency - Max: 2 GHz
- Number of Ports: 1
- Features: -
- Housing Color: Silver
- Ingress Protection: -
- Center Contact Material: Brass
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