VC-90-90-3

The VC-90-90-3 from Wakefield-Vette represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Vapor Chamber, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Bolt On options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Square geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Rated for 150W thermal loads, the solution handles transient heat spikes common in power electronics. The 150W capacity version supports overclocked CPU cooling at 95 C ambient.Achieving 0.143°C/W values, the thermal impedance outperforms aluminum heat sinks by 3:1 margin. The 0.140 C/W option is ideal for high-power RF amplifiers.Available in 3.543" (90.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.Precision-engineered 3.543" (90.00mm) tolerances ensure seamless integration with high-density electronic packaging. The 11.20mm variant is specifically tuned for GPU VRM cooling applications.With z-axis profiles as slim as 0.118" (3.00mm), the low-profile design enables deployment in space-constrained embedded systems without compromising thermal performance.Stable across 40°C ~ 140°C ranges, the hermetic sealing prevents performance degradation in extreme environments. The -55 C variant is MIL-STD-810G compliant.Compatible with Intel 2011 Square sockets, the mounting system ensures perfect interfacial contact for LGA3647 and similar high-TDP processors.