VC-1131-8175-517
Wakefield-Vette
VC-1131-8175-517
Wakefield-Vette
STANDARD VAPOR CHAMBER 113.1X81.
Reference Price (USD)
1+
$54.09000
500+
$53.5491
1000+
$53.0082
1500+
$52.4673
2000+
$51.9264
2500+
$51.3855
Exquisite packaging
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VC-1131-8175-517
$54.09
Product details
Wakefield-Vette's VC-1131-8175-517 redefines thermal management benchmarks in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for next-generation computing architectures, this thermal solution combines innovative wick structures with military-spec construction for reliable operation in harsh conditions.Functioning as a Vapor Chamber, the device employs two-phase heat transfer principles to achieve 5x better thermal conductivity than copper blocks. The vapor chamber variant features micro-channel reinforcement for 400W+ applications.Supporting Bolt On installation techniques, the system accommodates both permanent and serviceable thermal interfaces. Epoxy-mounted versions demonstrate 1000+ thermal cycles reliability.The Rectangular configuration is aerodynamically optimized for forced convection systems. Rectangular profiles show 18% lower pressure drop in wind tunnel tests.Capable of handling 180W thermal loads, the solution manages heat flux densities up to 300W/cm . The 110W model is ideal for FPGA cooling.Delivering 0.145°C/W performance metrics, the thermal impedance remains stable under dynamic loads. The 0.143 C/W option is preferred for 5G RF power amplifiers.Available in 5.240" (113.00mm) variants, the modular design enables custom thermal path optimization. The 450mm version is specifically engineered for rack-mounted server cooling.Precision-machined to 3.219" (81.75mm) specifications, the contact surfaces ensure <0.01mm flatness for optimal TIM performance. The 56mm variant supports chipset array cooling.With 0.204" (5.17mm) vertical clearance, the ultra-slim profile fits 1U chassis configurations while maintaining 100W cooling capacity.Reliable across 40°C ~ 140°C extremes, the solution features aerospace-grade sealing. The 180 C variant is qualified for under-hood automotive applications.Designed for VGA ecosystems, the mounting system ensures perfect die contact pressure distribution for LGA2066 processors.
Product Attributes
- Product Status: Active
- Type: Vapor Chamber
- Attachment Method: Bolt On
- Shape: Rectangular
- Power - Cooling: 180W
- Thermal Resistance: 0.145°C/W
- Wick Type: -
- Length: 5.240" (113.00mm)
- Width: 3.219" (81.75mm)
- Height: 0.204" (5.17mm)
- Diameter: -
- Operating Temperature: 40°C ~ 140°C
- Features: -
- Material: -
- Platform: VGA
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