VC-106-82-3
Wakefield-Vette
VC-106-82-3
Wakefield-Vette
STANDARD VAPOR CHAMBER 106X82X3M
Reference Price (USD)
1+
$45.87720
500+
$45.418428
1000+
$44.959656
1500+
$44.500884
2000+
$44.042112
2500+
$43.58334
Exquisite packaging
Discount
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VC-106-82-3
$45.88
Product details
Wakefield-Vette's VC-106-82-3 delivers breakthrough performance in Thermal - Heat Pipes, Vapor Chambers solutions. Tailored for high-density electronics cooling, this thermal management system combines advanced materials science with precision manufacturing for reliable heat dissipation.Functioning as a Vapor Chamber, the device implements two-phase cooling technology with thermal conductivities surpassing traditional solutions by 8x. The heat pipe variant features graded porosity wicks.Supporting Bolt On interface options, the system accommodates diverse assembly requirements. Push-pin versions enable tool-less installation for field serviceability.The Rectangular geometry is optimized for turbulent airflow conditions. Flat profiles demonstrate 25% better heat transfer in confined spaces.Capable of dissipating 150W thermal loads, the solution handles peak heat fluxes in power electronics. The 72.7W model is ideal for automotive ECUs.Delivering 0.140°C/W performance, the thermal path efficiency exceeds industry benchmarks. The 0.200 C/W option is preferred for high-power LEDs.Available in 4.173" (106.00mm) configurations, the modular design addresses thermal challenges across industries. The 200mm version is REACH compliant for global deployment.Precision-machined to 3.228" (82.00mm) tolerances, the contact surfaces ensure <0.005mm flatness. The 7.61mm variant is optimized for memory module cooling.With 0.118" (3.00mm) vertical clearance, the low-profile design fits slim industrial controllers. The 3.00mm version supports embedded computing applications.Reliable across 40°C ~ 140°C ranges, the solution features military-grade sealing. The 140 C variant is qualified for downhole drilling equipment.Designed for Intel 2011 Narrow ecosystems, the mounting system ensures optimal thermal contact for LGA1151 processors.
Product Attributes
- Product Status: Active
- Type: Vapor Chamber
- Attachment Method: Bolt On
- Shape: Rectangular
- Power - Cooling: 150W
- Thermal Resistance: 0.140°C/W
- Wick Type: -
- Length: 4.173" (106.00mm)
- Width: 3.228" (82.00mm)
- Height: 0.118" (3.00mm)
- Diameter: -
- Operating Temperature: 40°C ~ 140°C
- Features: -
- Material: -
- Platform: Intel 2011 Narrow
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