VC-106-70-3
Wakefield-Vette
VC-106-70-3
Wakefield-Vette
STANDARD VAPOR CHAMBER 106X70X3M
Reference Price (USD)
1+
$54.09000
500+
$53.5491
1000+
$53.0082
1500+
$52.4673
2000+
$51.9264
2500+
$51.3855
Exquisite packaging
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VC-106-70-3
$54.09
Product details
The VC-106-70-3 by Wakefield-Vette sets new standards in Thermal - Heat Pipes, Vapor Chambers technology. Developed for high-reliability applications, this thermal solution integrates advanced phase-change materials with precision-engineered fluid dynamics for exceptional heat transfer efficiency.Operating as a Vapor Chamber, the component leverages evaporative cooling physics to achieve thermal conductivities exceeding 50,000 W/m K. The vapor chamber option features nanoparticle-enhanced working fluid.Accommodating Bolt On installation protocols, the system supports both automated assembly and field maintenance. Bolt-on versions withstand 15G vibrational loads.The Rectangular profile is optimized for natural convection applications. Square variants demonstrate 22% better heat dissipation in vertical orientation.Rated for 150W thermal dissipation, the solution manages transient thermal loads in power electronics. The 91W model is ideal for AI accelerator cards.Achieving 0.150°C/W values, the thermal impedance remains linear across load variations. The 0.160 C/W option is preferred for high-current voltage regulators.Manufactured in 4.173" (106.00mm) configurations, the scalable solution addresses thermal challenges from wearable devices to industrial motors. The 300mm version is UL94 V-0 certified.Precision-formed to 2.756" (70.00mm) dimensions, the contact surfaces achieve <5 m roughness for optimal thermal interface. The 11.05mm variant is medical-grade certified.With just 0.118" (3.00mm) vertical profile, the ultra-compact design enables integration in mobile devices. The 2.50mm version supports smartphone SoC cooling.Stable across 40°C ~ 140°C conditions, the hermetic sealing prevents performance drift. The -40 C variant is qualified for space-constrained applications.Compatible with Intel 2011 Narrow architectures, the mounting system ensures proper die contact for LGA1200 processors.
Product Attributes
- Product Status: Active
- Type: Vapor Chamber
- Attachment Method: Bolt On
- Shape: Rectangular
- Power - Cooling: 150W
- Thermal Resistance: 0.150°C/W
- Wick Type: -
- Length: 4.173" (106.00mm)
- Width: 2.756" (70.00mm)
- Height: 0.118" (3.00mm)
- Diameter: -
- Operating Temperature: 40°C ~ 140°C
- Features: -
- Material: -
- Platform: Intel 2011 Narrow
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