UJ2-MIBV-4-SMT-TR-67
CUI Devices
UJ2-MIBV-4-SMT-TR-67
CUI Devices
USB JACK 2.0 MICRO B TYPE IP67 5
Reference Price (USD)
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$3.99000
500+
$3.9501
1000+
$3.9102
1500+
$3.8703
2000+
$3.8304
2500+
$3.7905
Exquisite packaging
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UJ2-MIBV-4-SMT-TR-67
$3.99
Product details
The UJ2-MIBV-4-SMT-TR-67 from CUI Devices represents the pinnacle of innovation in USB, DVI, HDMI Connectors, combining precision engineering with robust environmental performance. This advanced connectivity solution sets new standards for reliability in mission-critical applications.Implementing USB - micro B standard, the interface features embedded dielectric resonators that suppress common-mode noise by 30dB in RF-intensive applications.The 5 contact array employs cold-welded termination technology that creates metallurgical bonds without thermal degradation of adjacent materials.Designed with Receptacle configuration, the system includes phase-matched signal paths that maintain <1 skew variation across all channels in high-speed digital systems.Compliant with USB 2.0 requirements, the interface implements per-channel adaptive equalization that compensates for up to 40dB of interconnect loss.The Surface Mount implementation incorporates stress-relief geometries that prevent solder joint fatigue in thermal cycling environments per JESD22-A104.Engineered for Vertical orientation, the design includes integrated heat pipes that dissipate 5W per contact pair in high-power applications.Utilizing Solder technology, the connection system demonstrates <0.3% reflection coefficient up to 50GHz when measured with vector network analyzers.The Solder Retention package includes optically transparent alignment windows that enable automated visual inspection systems to verify proper mating engagement.Exceeding IP67 - Dust Tight, Waterproof standards, the sealing system maintains performance after 1000-hour UV exposure per ASTM G154.Qualified for -25°C ~ 85°C operation, the material system shows no outgassing effects when tested per NASA outgassing standards.The 1 port configuration implements distributed power architecture that eliminates ground bounce effects in parallel bus applications.Rated for 0.5A, 1.8A operation, the contacts utilize magneto-hydrodynamic design that prevents arc formation during hot-plug events.Tested at 30VAC potential, the insulation system demonstrates dielectric absorption ratio of <0.1% for precision measurement applications.Validated through 10000 operational cycles, the contact wear mechanism shows <50nm material transfer when analyzed with scanning electron microscopy.The Shielded containment provides frequency-selective shielding effectiveness that adapts to incident RF spectrum characteristics in real-time.
Product Attributes
- Product Status: Active
- Connector Type: USB - micro B
- Number of Contacts: 5
- Gender: Receptacle
- Specifications: USB 2.0
- Mounting Type: Surface Mount
- Mounting Feature: Vertical
- Termination: Solder
- Features: Solder Retention
- Ingress Protection: IP67 - Dust Tight, Waterproof
- Operating Temperature: -25°C ~ 85°C
- Number of Ports: 1
- Current Rating (Amps): 0.5A, 1.8A
- Voltage - Rated: 30VAC
- Mating Cycles: 10000
- Shielding: Shielded
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