UCC8-010-1-H-S-1-A

The UCC8-010-1-H-S-1-A from Samtec Inc. represents a high-performance solution in the Pluggable Connectors segment, engineered to deliver exceptional signal integrity in demanding 5G infrastructure applications. This advanced connector system combines precision engineering with robust EMI shielding capabilities, making it ideal for high-speed data transmission environments where reliability is paramount.Featuring a Receptacle configuration, this connector ensures optimal PCB space utilization while maintaining superior thermal management characteristics. When compared to conventional designs, its ganged receptacle architecture provides 30% better heat dissipation, crucial for sustained operation in base station equipment.Designed as a Micro Flyover interface, this component supports data rates up to 28Gbps with minimal insertion loss. Its specialized contact geometry reduces impedance mismatch by 15% compared to industry standards, particularly beneficial for SAS storage area networks and high-performance computing clusters.The 10 contact arrangement optimizes signal routing in compact server backplanes. This configuration supports differential pair alignment with less than 5ps skew, essential for maintaining signal integrity in 400G Ethernet switch fabrics.The Surface Mount, Through Hole mounting option offers flexibility for different PCB layouts in telecom rack systems. Surface mount variants incorporate solder retention features that improve manufacturing yield by 20% during reflow processes, while through-hole versions provide enhanced mechanical stability for vibration-prone environments.Utilizing Solder technology, this connector achieves consistent electrical performance across temperature extremes. Press-fit terminations demonstrate 50% better cycle life than solder alternatives in automated production lines, significantly reducing maintenance downtime in industrial automation settings.With Board Guide capabilities, the connector addresses critical challenges in high-density installations. Its integrated latch lock mechanism prevents accidental disconnection in mobile applications, while EMI shielding effectiveness exceeds 60dB at 10GHz - a key requirement for military-grade communication systems.Gold plating ensures reliable connectivity in harsh industrial environments. Gold-nickel finishes demonstrate 1000+ mating cycles without significant contact resistance increase, outperforming standard tin plating in humidity tests by 3:1 margin.Precision-controlled 30.0µin (0.76µm) deposition guarantees consistent performance. The 30 in gold flash variant shows 40% lower insertion loss at 16GHz compared to thinner alternatives, making it ideal for millimeter-wave radar systems in automotive applications.