TXBF-019-025U
CTS Thermal Management Products
TXBF-019-025U
CTS Thermal Management Products
THERMAL LINK PRESSON TO-18
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Product details
The TXBF-019-025U by CTS Thermal Management Products delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.The Dual-Phase Heat Pipe design maintains thermal resistance within 5% variance in zero-g conditions. Unlike conventional solutions, this configuration operates effectively at any orientation with respect to gravity.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.The Flexure Mount system compensates for CTE mismatches in composite satellite structures. The design maintains thermal contact pressure within 10% across the full operational temperature range.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.For cylindrical transceiver modules, the 0.500" (12.70mm) OD variant provides complete 360 thermal coupling. The design maintains contact pressure in microgravity environments.Optimized 0.250" (6.35mm) ensures effective radiation cooling in vacuum conditions. The black anodized surface maintains emissivity >0.95 after prolonged UV exposure.The 150.00°C/W specification enables passive thermal control in spacecraft applications. The design maintains components within operational limits using only radiation cooling.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.
Product Attributes
- Product Status: Obsolete
- Type: Top Mount
- Package Cooled: TO-18
- Attachment Method: Press Fit
- Shape: Cylindrical
- Length: -
- Width: -
- Diameter: 0.500" (12.70mm) OD
- Fin Height: 0.250" (6.35mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 150.00°C/W
- Material: Beryllium Copper
- Material Finish: -
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