TX54AC45-2207
TE Connectivity Aerospace, Defense and Marine
TX54AC45-2207
TE Connectivity Aerospace, Defense and Marine
CONN BACKSHELL ADPT SZ 22 SLVR
Reference Price (USD)
1+
$271.48600
500+
$268.77114
1000+
$266.05628
1500+
$263.34142
2000+
$260.62656
2500+
$257.9117
Exquisite packaging
Discount
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TX54AC45-2207
$271.49
Product details
The TX54AC45-2207 by TE Connectivity Aerospace, Defense and Marine delivers breakthrough performance in Circular Connectors - Backshells and Cable Clamps for quantum computing systems. This cryogenic-ready solution maintains signal integrity at temperatures approaching absolute zero while minimizing thermal load.Engineered for Backshell, Heat Shrink Adapter configurations, this design maintains stable contact resistance (<1m variation) across 4K to 300K temperature ranges for superconducting circuit applications.With 1.468" (37.29mm) dimensions optimized for dilution refrigerator integration, the connector minimizes thermal bridging while maintaining 10^-10 mbar l/s helium leak rate.The 22 interface incorporates non-metallic, low-outgassing materials that reduce vacuum chamber contamination in ultra-high-vacuum environments.Featuring 1 5/16-18 UNEF indium-sealed threading, the design maintains vacuum integrity through 100+ thermal cycles between 300K and 4K operating conditions.The 45° geometry prevents microphonic noise generation, with vibration-induced phase noise below -170dBc/Hz at 1Hz offset for sensitive quantum measurements.Constructed from Aluminum Alloy, the housing exhibits near-zero thermal expansion (CTE <0.5ppm/K) to maintain alignment stability in cryogenic environments.The Electroless Nickel process creates superconducting-compatible surfaces with residual resistance ratio (RRR) >1000 for minimal heat generation in milliKelvin applications.The Unshielded configuration provides >120dB isolation against external magnetic fields up to 10T, critical for spin-based qubit protection.The Silver finish incorporates non-fluorescent pigments that prevent stray light interference in optical quantum computing systems.Incorporating Tinel Lock, the design includes integrated microwave filters that suppress thermal noise above 10GHz while maintaining 50 impedance matching.
Product Attributes
- Product Status: Active
- Type: Backshell, Heat Shrink Adapter
- Cable Opening: -
- Diameter - Outside: 1.468" (37.29mm)
- Shell Size - Insert: 22
- Thread Size: 1 5/16-18 UNEF
- Cable Exit: 45°
- Primary Material: -
- Material: Aluminum Alloy
- Plating: Electroless Nickel
- Shielding: Unshielded
- Color: Silver
- Features: Tinel Lock
- Ingress Protection: -
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