TW-T300-01-20
3G Shielding Specialties LP
TW-T300-01-20
3G Shielding Specialties LP
THERMAL INTERFACE MATERIAL
Reference Price (USD)
1+
$85.00000
500+
$84.15
1000+
$83.3
1500+
$82.45
2000+
$81.6
2500+
$80.75
Exquisite packaging
Discount
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TW-T300-01-20
$85.00
Product details
3G Shielding Specialties LP's TW-T300-01-20 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.Developed specifically for Multi in quantum processors, this material operates effectively from 4K to 300K. Its unique thermal expansion properties match superconducting materials, preventing interface stress during temperature cycling.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.With 300.00mm x 200.00mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0790" (2.000mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Silicone Elastomer, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.The Fiberglass system ensures contamination-free handling in cleanroom environments. This ultra-clean release mechanism prevents particulate generation during installation.The Blue identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 3.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: Multi
- Type: Gap Filler Pad, Sheet
- Shape: -
- Outline: 300.00mm x 200.00mm
- Thickness: 0.0790" (2.000mm)
- Material: Silicone Elastomer
- Adhesive: -
- Backing, Carrier: Fiberglass
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K
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