TMS320DM6467CZUTD7

Optimized for renewable energy systems, Texas Instruments's TMS320DM6467CZUTD7 delivers precision Embedded - DSP (Digital Signal Processors) performance for solar inverters and wind turbine controls. This advanced DSP solution combines real-time processing with robust connectivity for smart grid applications.The Digital Media System-on-Chip (DMSoC) architecture incorporates specialized math accelerators for power conversion algorithms. Its dual-core design enables simultaneous execution of maximum power point tracking and grid synchronization routines.Featuring EBI/EMI, Ethernet, HPI, I²C, McASP, PCI, SPI, UART, USB support, the device integrates seamlessly with industrial communication protocols like Modbus and EtherCAT. The isolated serial interfaces meet reinforced insulation requirements for photovoltaic systems.With 729MHz DSP, 364.5MHz ARM® operation, the processor achieves the precise timing needed for PWM generation in multi-level converters. The jitter-attenuated clock tree ensures clean switching waveforms in high-power applications.The ROM (8kB) implementation includes cyclic redundancy checks for firmware integrity in remote installations. The sector-based protection mechanism prevents unauthorized code modifications.Equipped with 248kB, the DSP handles real-time power quality analysis without external memory. The dual-port architecture enables concurrent access from multiple processing cores.The 1.8V, 3.3V tolerant design withstands voltage transients common in power electronics. The reinforced isolation barriers meet IEC 61800-5-1 safety standards for drive systems.Operating at 1.20V, the processor implements predictive power gating for energy-efficient operation. The adaptive voltage scaling maintains performance across varying load conditions.Certified for -40°C ~ 85°C (TC), the device operates reliably in solar tracker systems. The extended temperature qualification includes damp heat testing per IEC 61215.The Surface Mount configuration resists mechanical stress in wind turbine nacelles. The package design prevents solder joint fatigue under continuous vibration.The 529-BFBGA construction features enhanced creepage distance for high-voltage applications. The material selection ensures long-term reliability in humid environments.Delivered in 529-FCBGA (19x19), this power conversion DSP meets UL certification requirements. The package includes flame-retardant materials for safety-critical installations.