TMJ03DKSD-S1512
Sullins Connector Solutions
TMJ03DKSD-S1512
Sullins Connector Solutions
CONN TRANSIST TO-254 3POS GOLD
Reference Price (USD)
1+
$16.32200
500+
$16.15878
1000+
$15.99556
1500+
$15.83234
2000+
$15.66912
2500+
$15.5059
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TMJ03DKSD-S1512
$16.32
Product details
Designed for mission-critical systems, TMJ03DKSD-S1512 by Sullins Connector Solutions sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The Transistor, TO-254 configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 3 (Rectangular) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.150" (3.81mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Gold finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.The 30.0µin (0.76µm) coating provides exceptional durability. Wear testing indicates <0.5 m material loss after 25,000 insertion cycles.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Through Hole design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Flange, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.150" (3.81mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Gold plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The 30.0µin (0.76µm) finish ensures perfect solder joints. Cross-section analysis reveals 100% intermetallic coverage in reflow processes.The Beryllium Copper posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Polyphenylene Sulfide (PPS) housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.Rated for -50°C ~ 175°C, the socket performs reliably in desert warfare equipment. Testing confirms full functionality during rapid temperature transitions.
Product Attributes
- Product Status: Active
- Type: Transistor, TO-254
- Number of Positions or Pins (Grid): 3 (Rectangular)
- Pitch - Mating: 0.150" (3.81mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Through Hole
- Features: Flange
- Termination: Solder
- Pitch - Post: 0.150" (3.81mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
- Housing Material: Polyphenylene Sulfide (PPS)
- Operating Temperature: -50°C ~ 175°C
You May Also Be Interested In
