TH997-288-192-1.0

The TH997-288-192-1.0 from Penchem Technologies Sdn Bhd represents a significant advancement in Thermal - Pads, Sheets for industrial automation systems. This robust thermal solution is specifically designed to meet the demanding requirements of factory automation equipment and industrial control systems.Developed for Thermally Conductive scenarios, this thermal interface material maintains performance in dusty industrial environments. Its unique composition resists contamination while maintaining excellent thermal transfer characteristics.As a high-reliability Gap Filler Pad, Sheet, this product offers exceptional long-term stability under continuous operation. The material maintains its thermal properties even after extended exposure to industrial operating conditions.Precision-engineered in Rectangular formats, this solution enables efficient thermal management of industrial power electronics. The optimized geometries ensure maximum contact area with heat-generating components.Available in 288.00mm x 192.00mm sizes, this material accommodates both large motor drives and compact control modules. The standardized dimensions ensure compatibility with common industrial enclosure designs.The carefully controlled 0.0394" (1.000mm) provides optimal balance between thermal transfer and mechanical compliance. This characteristic is particularly valuable in applications subject to mechanical vibration.Formulated with industrial-grade Silicone, this pad exhibits exceptional resistance to oils and chemicals. This property ensures reliable performance in harsh manufacturing environments.Featuring Tacky - Both Sides properties, this solution offers secure component bonding in vibrating environments. The high-tack formulation maintains adhesion integrity throughout the product lifecycle.The Blue identification system enables quick visual verification during maintenance procedures. This feature simplifies component replacement in complex industrial systems.Achieving 2.4W/m-K performance, this solution enables more efficient cooling of industrial power electronics. The material's consistent performance helps extend component lifespan in demanding applications.