TH994-288-192-5.0

The TH994-288-192-5.0 from Penchem Technologies Sdn Bhd delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.Engineered for Thermally Conductive in military electronics, this material performs reliably from -55 C to 200 C. When subjected to altitude variations from sea level to 70,000 feet, it maintains consistent thermal interface properties without degradation.As a MIL-spec Gap Filler Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Rectangular configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 288.00mm x 192.00mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.197" (5.00mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Silicone, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.Featuring Tacky - Both Sides properties, this solution offers instant bonding in field repair situations. The high-tack formulation ensures immediate attachment even in dusty or oily conditions.The Gray coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 8.0W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.