TH235-2-50G-4JAR

The TH235-2-50G-4JAR from Penchem Technologies Sdn Bhd represents a cutting-edge solution in Thermal - Adhesives, Epoxies, Greases, Pastes, engineered for high-performance thermal management applications. This advanced material delivers exceptional heat dissipation while maintaining optimal viscosity across extreme operating conditions. With its specialized formulation, it addresses critical challenges in modern electronics cooling systems.As a Non-Silicone Putty thermal interface material, this product provides superior thermal coupling between components. When compared to conventional compounds, its unique composition ensures minimal thermal resistance under {Usable Temperature Range} conditions.Available in 50 gram Jar packaging options, this material offers flexibility for both small-scale prototyping and high-volume production. The precisely calibrated container sizes prevent waste while ensuring consistent application thickness.Operating within 5°F ~ 248°F (-15°C ~ 200°C), this thermal compound maintains stable performance characteristics. Whether subjected to cryogenic temperatures or elevated thermal loads, its molecular structure remains intact for reliable heat transfer.The distinctive Blue pigmentation serves as a visual indicator for quality control during application. This chromatic feature aids in uniform distribution verification while meeting industry-standard identification protocols.With 4.00W/m-K thermal conductivity, this material outperforms conventional thermal interfaces by 15-20%. Its optimized thermal pathway architecture significantly reduces junction temperatures in power electronics.The extended 18 Months shelf life ensures long-term usability without performance degradation. Proper storage according to {Storage/Refrigeration Temperature} guidelines preserves the material's rheological properties.