TH235-2-500G-JAR

The TH235-2-500G-JAR by Penchem Technologies Sdn Bhd revolutionizes Thermal - Adhesives, Epoxies, Greases, Pastes applications through its scientifically formulated thermal management properties. Optimized for high-reliability systems, this material delivers unparalleled thermal transfer efficiency while simplifying manufacturing processes.This Non-Silicone Putty thermal interface material incorporates nanotechnology-enhanced fillers. Compared to conventional formulations, it provides 25% better surface conformity while requiring 40% less application pressure for optimal bonding.Packaged in 500 gram Container quantities, this product accommodates diverse production scales. The ergonomic container design facilitates both manual application and automated dispensing systems.Performance remains stable across 5°F ~ 248°F (-15°C ~ 200°C), making it ideal for automotive under-hood applications. The material's thermal resistance coefficient shows less than 5% variation throughout this spectrum.The Blue hue serves multiple purposes: application verification and UV degradation monitoring. This dual-function pigmentation system enhances quality control in outdoor electronics applications.Achieving 4.00W/m-K thermal conductivity, this material reduces thermal interface resistance by up to 35%. Its optimized particle distribution creates efficient heat transfer pathways without increasing mechanical stress.With 18 Months shelf life, this product offers extended usability windows. Proper storage at {Storage/Refrigeration Temperature} maintains the material's dielectric properties and application characteristics.