TGH-1535-01

t-Global Technology

General info

Part Number

TGH-1535-01

Manufacturer

t-Global Technology

Description:

ALUMINIUM HEAT SINK 153.5X150MM

Reference Price (USD)

$63.04000

500+

$62.4096

1000+

$61.7792

1500+

$61.1488

2000+

$60.5184

2500+

$59.888

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

TGH-1535-01

$63.04

Product details

t-Global Technology's TGH-1535-01 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 6.043" (153.50mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 5.906" (150.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 1.338" (34.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.