TGH-0130-01

t-Global Technology

General info

Part Number

TGH-0130-01

Manufacturer

t-Global Technology

Description:

ALUMINIUM HEAT SINK 13X13MM

Reference Price (USD)

$1.80000

500+

$1.782

1000+

$1.764

1500+

$1.746

2000+

$1.728

2500+

$1.71

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

TGH-0130-01

$1.80

Product details

The TGH-0130-01 from t-Global Technology sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 0.512" (13.00mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 0.512" (13.00mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 0.236" (6.00mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.Black PVD coating ensures aesthetic consistency with consumer electronics while improving radiative cooling. The finish meets MIL-STD-810G abrasion resistance requirements.