TGF50-07870787-118
Leader Tech Inc.
TGF50-07870787-118
Leader Tech Inc.
THERM PAD 199.9MMX199.9MM WHITE
Reference Price (USD)
1+
$112.32000
500+
$111.1968
1000+
$110.0736
1500+
$108.9504
2000+
$107.8272
2500+
$106.704
Exquisite packaging
Discount
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TGF50-07870787-118
$112.32
Product details
Leader Tech Inc.'s TGF50-07870787-118 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gap Filler Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 199.90mm x 199.90mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.118" (3.00mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Aluminum Oxide filled Silicone formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.The White coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.With an exceptionally low 0.70°C/W value, this material minimizes thermal gradients across interfaces. The result is more stable operating temperatures for sensitive RF components.Delivering 5.0W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 199.90mm x 199.90mm
- Thickness: 0.118" (3.00mm)
- Material: Aluminum Oxide filled Silicone
- Adhesive: -
- Backing, Carrier: -
- Color: White
- Thermal Resistivity: 0.70°C/W
- Thermal Conductivity: 5.0W/m-K
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