TGF10-07870787-039

Leader Tech Inc.'s TGF10-07870787-039 redefines excellence in Thermal - Pads, Sheets for mission-critical thermal management. Designed for aerospace and defense applications, this high-reliability solution combines cutting-edge materials science with precision manufacturing processes to deliver unmatched thermal performance.The Gap Filler Pad, Sheet construction provides exceptional dielectric strength while maintaining thermal efficiency. This dual functionality makes it particularly valuable in high-voltage applications where electrical isolation is as crucial as thermal management.Precision-engineered in Square formats, this product enables optimal thermal pathway design. The geometrically optimized profiles minimize thermal impedance while maximizing contact area with heat-generating components.Available in 199.90mm x 199.90mm sizes, this solution accommodates both large-area cooling and localized hot spot management. The standardized dimensions ensure compatibility with common heat sink designs and mounting patterns.With a controlled 0.0390" (0.991mm) tolerance, this material provides predictable thermal performance. The uniform cross-section guarantees consistent interface pressure across the entire contact surface.The proprietary Aluminum Oxide filled Silicone formulation offers exceptional resistance to thermal cycling effects. This characteristic significantly extends service life in applications subject to frequent temperature fluctuations.The Tacky - Both Sides system provides immediate bond strength without requiring curing time. This instant tack property is particularly beneficial for high-volume production environments.The Gray pigmentation serves as a visual indicator of material grade and properties. This identification system streamlines inventory management and prevents misapplication in complex assemblies.With a remarkably low 2.00°C/W value, this material minimizes temperature gradients across interfaces. The result is more efficient heat transfer and reduced thermal stress on sensitive components.Achieving 1.0W/m-K performance, this solution enables more compact thermal designs. Engineers can specify smaller heat sinks without compromising cooling efficiency, saving valuable space in dense layouts.