TG994-288-192-2.5
t-Global Technology
TG994-288-192-2.5
t-Global Technology
HIGH PERFORMANCE SILICONE GAP FI
Reference Price (USD)
1+
$99.84000
500+
$98.8416
1000+
$97.8432
1500+
$96.8448
2000+
$95.8464
2500+
$94.848
Exquisite packaging
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TG994-288-192-2.5
$99.84
Product details
t-Global Technology's TG994-288-192-2.5 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Conductive Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Rectangular configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 288.00mm x 192.00mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0984" (2.500mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Constructed from quantum-grade Silicone, this pad exhibits exceptional purity (99.9999%). The defect-free crystalline structure minimizes thermal phonon scattering at cryogenic temperatures.Featuring Tacky - Both Sides properties, this solution offers cryogenic-compatible bonding. The specialized formulation maintains adhesion integrity across extreme temperature ranges without outgassing.The Gray identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 13W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Obsolete
- Usage: -
- Type: Conductive Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.0984" (2.500mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 13W/m-K
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