TG-NSP-60 4OZ
t-Global Technology
TG-NSP-60 4OZ
t-Global Technology
NON-SILICONE PUTTY 6 W/MK 4OZ
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Product details
The TG-NSP-60 4OZ from t-Global Technology represents a quantum leap in Thermal - Adhesives, Epoxies, Greases, Pastes technology, specifically developed for high-voltage power conversion systems. This innovative solution combines unparalleled efficiency with robust protection features for demanding industrial applications.This Non-Silicone Putty power module integrates advanced wide-bandgap semiconductor technology. Compared to silicon-based devices, it delivers 99% conversion efficiency while reducing switching losses by 60%.
Product Attributes
- Product Status: Obsolete
- Type: Non-Silicone Putty
- Size / Dimension: 4 oz Jar
- Usable Temperature Range: -67°F ~ 392°F (-55°C ~ 200°C)
- Color: Gray
- Thermal Conductivity: 5.90W/m-K
- Features: -
- Shelf Life: -
- Storage/Refrigeration Temperature: -
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