TG-NSP-60 1LB
t-Global Technology
TG-NSP-60 1LB
t-Global Technology
NON-SILICONE PUTTY 6 W/MK 1LB
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TG-NSP-60 1LB
$0.00
Product details
The TG-NSP-60 1LB from t-Global Technology represents a technological leap in Thermal - Adhesives, Epoxies, Greases, Pastes, specifically formulated for next-generation thermal management solutions. This high-performance material combines exceptional thermal transfer capabilities with outstanding reliability for mission-critical applications.This Non-Silicone Putty thermal interface material incorporates advanced polymer technology. Unlike conventional compounds, its viscoelastic properties adapt to thermal expansion differentials, maintaining optimal interface pressure throughout {Usable Temperature Range}.The 1 lb Jar packaging options cater to diverse manufacturing needs. Precision-engineered containers ensure consistent material properties from first to last use, reducing application variability.Engineered for -67°F ~ 392°F (-55°C ~ 200°C) operation, this material demonstrates exceptional stability. Testing shows less than 3% thermal resistance variation after 1000 cycles, making it ideal for industrial automation systems.Gray coloration provides immediate visual confirmation of proper application. This quality assurance feature is particularly valuable in high-reliability applications where inspection access is limited.Delivering 5.90W/m-K thermal conductivity, this compound outperforms standard materials by 30-35%. Its optimized filler distribution creates efficient thermal pathways without compromising dielectric strength.
Product Attributes
- Product Status: Obsolete
- Type: Non-Silicone Putty
- Size / Dimension: 1 lb Jar
- Usable Temperature Range: -67°F ~ 392°F (-55°C ~ 200°C)
- Color: Gray
- Thermal Conductivity: 5.90W/m-K
- Features: -
- Shelf Life: -
- Storage/Refrigeration Temperature: -
You May Also Be Interested In
