TG-A1660-5-5-2.0

The TG-A1660-5-5-2.0 by t-Global Technology revolutionizes Thermal - Pads, Sheets solutions for medical imaging equipment. Designed for precision thermal control in diagnostic systems, this advanced material ensures stable operation of sensitive imaging sensors while meeting stringent medical safety standards.Optimized for Multi in medical devices, this thermal interface maintains consistent performance across sterilization cycles. When subjected to repeated autoclaving, it retains over 95% of its original thermal transfer properties, outperforming conventional medical-grade materials.As a medical-certified Gap Filler Pad, Sheet, this product combines biocompatibility with exceptional thermal conductivity. Unlike standard thermal pads, it meets ISO 10993 requirements while providing superior heat dissipation for critical imaging components.Precision-cut in Square configurations, this material accommodates complex sensor array geometries. The laser-cut edges ensure contamination-free installation in cleanroom environments.With 5.00mm x 5.00mm dimensions, this solution fits standard medical imaging module footprints. The size-optimized design allows for efficient thermal management without interfering with sensitive optical paths.Featuring ultra-precise 0.0790" (2.000mm) control ( 0.02mm), this material ensures perfect sensor-to-heatsink contact. The uniform cross-section guarantees consistent interface pressure across delicate imaging surfaces.Formulated with medical-grade Silicone, this pad exhibits exceptional resistance to gamma radiation and chemical disinfectants. This unique property makes it ideal for reusable medical equipment requiring frequent sterilization.The Gray pigmentation provides clear visual differentiation in multi-layer assemblies. This medical-grade coloring system aids in quick identification during equipment servicing.Delivering 16.6W/m-K performance, this material enables precise temperature control of imaging sensors. The anisotropic properties allow directional heat flow while minimizing lateral thermal spread.