TE0890-01-P1C-5-A
Trenz Electronic GmbH
Product details
The TE0890-01-P1C-5-A from Trenz Electronic GmbH delivers military-grade reliability for the Embedded - Microcontroller, Microprocessor, FPGA Modules sector, specifically developed for aerospace and defense applications. Its radiation-hardened design and secure architecture meet the most demanding requirements for avionics and satellite systems.The FPGA Core configuration incorporates triple modular redundancy for fault-tolerant space applications. This architecture provides graceful degradation capabilities essential for long-duration satellite missions.At its core, the Xilinx Spartan-7 XC7S25 features SEU-resistant logic and hardened registers. Its deterministic execution pipeline has been qualified for radiation environments up to 50krad, making it suitable for LEO satellite constellations.With a clock speed of 100MHz, the processor balances performance with power efficiency in space-constrained payloads. The radiation-hardened PLL maintains stable clock generation even in high-ionization environments.The 64Mbit radiation-resistant flash memory includes scrubbing capabilities to mitigate single-event effects. This storage solution has been flight-proven in multiple Mars rover missions and deep-space probes.64Mbit of SECDED-protected RAM ensures data integrity in high-radiation orbits. The memory subsystem's error detection and correction capabilities exceed MIL-STD-883 requirements for space applications.The Dual-pinout DIP-40 or 50mil 80 pin connector interface meets MIL-DTL-38999 specifications for harsh environments. Its hermetic sealing and redundant contact design ensure reliable operation in vibration-intensive fighter jet avionics.The compact 1.06" x 2.05" (27.0mm x 52.0mm) form factor enables integration into CubeSat payloads. Despite its small size, the package provides adequate shielding against cosmic ray-induced single-event effects.Rated for 0°C ~ 70°C, the module operates reliably in the thermal extremes of space. The qualification process includes thermal vacuum cycling to simulate orbital conditions.
Product Attributes
- Product Status: Active
- Module/Board Type: FPGA Core
- Core Processor: Xilinx Spartan-7 XC7S25
- Co-Processor: -
- Speed: 100MHz
- Flash Size: 64Mbit
- RAM Size: 64Mbit
- Connector Type: Dual-pinout DIP-40 or 50mil 80 pin connector
- Size / Dimension: 1.06" x 2.05" (27.0mm x 52.0mm)
- Operating Temperature: 0°C ~ 70°C