TE0803-03-5DE11-A

Engineered for next-generation automotive electronics, the TE0803-03-5DE11-A by Trenz Electronic GmbH redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MPU Core architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The Zynq UltraScale+ XCZU5EV-1SFVC784E delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.The 128MB flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.2GB of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade B2B interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.With dimensions of 2.05" x 2.99" (52mm x 76mm), the module fits within stringent automotive form factor requirements. The package's thermal design maintains performance during extended high-temperature operation in engine compartments.Qualified for 0°C ~ 85°C, the solution withstands the thermal extremes of electric vehicle power electronics. Extensive reliability testing ensures operation throughout the vehicle's lifespan.