TE0720-03-S008C1
Trenz Electronic GmbH
TE0720-03-S008C1
Trenz Electronic GmbH
IC SOC MODULE XILINX ZYNQ
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Product details
Trenz Electronic GmbH's TE0720-03-S008C1 represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The MCU, FPGA design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.Featuring the ARM Cortex-A9 with 256-bit vector processing units, this solution accelerates complex data analytics. The multi-die architecture enables seamless scaling for demanding database acceleration tasks in financial services.The Zynq-7000 (Z-7020) provides dedicated hardware for cryptographic operations, achieving 100Gbps encryption throughput. This security engine meets FIPS 140-3 Level 4 requirements for government cloud infrastructure.The 8GB persistent memory supports in-memory database acceleration. Its byte-addressable architecture reduces latency by 10x compared to traditional storage in big data applications.The Samtec LSHM interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 1.97" x 1.57" (50mm x 40mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.
Product Attributes
- Product Status: Discontinued at Digi-Key
- Module/Board Type: MCU, FPGA
- Core Processor: ARM Cortex-A9
- Co-Processor: Zynq-7000 (Z-7020)
- Speed: -
- Flash Size: 8GB
- RAM Size: -
- Connector Type: Samtec LSHM
- Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
- Operating Temperature: -
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