TE0715-04-73E33-A

Trenz Electronic GmbH's TE0715-04-73E33-A represents a paradigm shift in Embedded - Microcontroller, Microprocessor, FPGA Modules technology, engineered for next-generation data center acceleration. Its hardware-optimized architecture delivers breakthrough performance for hyperscale computing and network function virtualization workloads.The MCU, FPGA design incorporates silicon photonics integration for high-speed data movement. This innovative approach reduces power consumption by 40% compared to traditional electrical interconnects in cloud server applications.Featuring the ARM Cortex-A9 with 256-bit vector processing units, this solution accelerates complex data analytics. The multi-die architecture enables seamless scaling for demanding database acceleration tasks in financial services.The Zynq-7000 (Z-7030) provides dedicated hardware for cryptographic operations, achieving 100Gbps encryption throughput. This security engine meets FIPS 140-3 Level 4 requirements for government cloud infrastructure.With a base clock of 125MHz, the processor maintains consistent performance across all cores. The advanced clock mesh distribution ensures minimal skew in large-scale server deployments.The 32MB persistent memory supports in-memory database acceleration. Its byte-addressable architecture reduces latency by 10x compared to traditional storage in big data applications.1GB of HBM2E memory delivers 460GB/s bandwidth for memory-intensive workloads. The 3D-stacked design optimizes space utilization in high-density server racks.The Samtec LSHM interface supports 400G Ethernet connectivity for next-gen data centers. Its crosstalk suppression technology maintains signal integrity in fully populated switch fabrics.The 1.97" x 1.57" (50mm x 40mm) form factor complies with OCP accelerator module specifications. The innovative cooling solution enables 300W TDP operation in constrained server environments.Designed for -40°C ~ 85°C, the solution operates reliably in liquid-cooled data centers. The corrosion-resistant packaging withstands direct-contact cooling fluids.