TE0712-02-72C03-M

The TE0712-02-72C03-M from Trenz Electronic GmbH delivers military-grade reliability for the Embedded - Microcontroller, Microprocessor, FPGA Modules sector, specifically developed for aerospace and defense applications. Its radiation-hardened design and secure architecture meet the most demanding requirements for avionics and satellite systems.The FPGA Core configuration incorporates triple modular redundancy for fault-tolerant space applications. This architecture provides graceful degradation capabilities essential for long-duration satellite missions.With a clock speed of 200MHz, the processor balances performance with power efficiency in space-constrained payloads. The radiation-hardened PLL maintains stable clock generation even in high-ionization environments.The 32MB radiation-resistant flash memory includes scrubbing capabilities to mitigate single-event effects. This storage solution has been flight-proven in multiple Mars rover missions and deep-space probes.1GB of SECDED-protected RAM ensures data integrity in high-radiation orbits. The memory subsystem's error detection and correction capabilities exceed MIL-STD-883 requirements for space applications.The Samtec LSHM interface meets MIL-DTL-38999 specifications for harsh environments. Its hermetic sealing and redundant contact design ensure reliable operation in vibration-intensive fighter jet avionics.The compact 1.97" x 1.57" (50mm x 40mm) form factor enables integration into CubeSat payloads. Despite its small size, the package provides adequate shielding against cosmic ray-induced single-event effects.Rated for 0°C ~ 85°C, the module operates reliably in the thermal extremes of space. The qualification process includes thermal vacuum cycling to simulate orbital conditions.