TE0320-00-EV02I

The TE0320-00-EV02I from Trenz Electronic GmbH represents a cutting-edge solution in the Embedded - Microcontroller, Microprocessor, FPGA Modules segment, engineered for high-performance embedded systems. This module combines advanced signal processing capabilities with robust power efficiency, making it ideal for 5G infrastructure and edge computing applications where low-latency operation is critical.Featuring a versatile FPGA, USB Core architecture, this component delivers exceptional flexibility for multi-core processing tasks. When compared to conventional designs, its hybrid FPGA-MPU configuration enables superior parallel computation while maintaining precise clock synchronization across all cores.At the heart of the system lies the Spartan-3A DSP, optimized for real-time digital signal processing with its advanced pipeline architecture. The processor's instruction set acceleration ensures deterministic execution cycles, crucial for industrial automation timing constraints.The integrated Cypress EZ-USB FX2LP significantly enhances computational density, providing dedicated hardware acceleration for complex algorithms. This co-processing unit features adaptive voltage scaling to balance thermal dissipation with processing throughput in automotive ECUs.Operating at 100MHz, the module achieves industry-leading performance-per-watt metrics. This clock frequency has been carefully validated to maintain signal integrity while minimizing electromagnetic interference in dense PCB layouts.With 4MB of non-volatile memory, the device offers ample storage for firmware and configuration data. The flash memory subsystem incorporates error correction codes (ECC) to ensure data reliability in mission-critical aerospace applications.The 128MB high-speed memory supports demanding multi-threaded operations. Its low-latency access architecture is particularly effective for buffering high-bandwidth sensor data in autonomous driving systems.The B2B interface provides robust mechanical and electrical connections, developed for vibration-resistant industrial environments. Its impedance-matched design preserves signal quality even in extended cable runs common in factory automation.Measuring just 2.7" x 1.9" (68mm x 48mm), this compact form factor enables high-density installations. The precision-engineered package maintains thermal performance characteristics essential for medical imaging equipment.Rated for -40°C ~ 85°C, the module delivers reliable operation in extreme conditions. This temperature resilience, combined with conformal coating options, makes it suitable for outdoor IoT deployments in harsh climates.