TC3-1G
Chip Quik Inc.
TC3-1G
Chip Quik Inc.
HEAT SINK THERMAL COMPOUND
Reference Price (USD)
1+
$5.95000
500+
$5.8905
1000+
$5.831
1500+
$5.7715
2000+
$5.712
2500+
$5.6525
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TC3-1G
$5.95
Product details
The TC3-1G by Chip Quik Inc. is a breakthrough in Thermal - Adhesives, Epoxies, Greases, Pastes, designed for ultra-high-frequency circuit applications. This precision component delivers exceptional signal integrity while minimizing insertion loss, making it indispensable for RF and microwave systems.As a Silicone Compound RF component, this device features patented impedance matching technology. When compared to conventional designs, its innovative architecture reduces return loss by up to 40% across {Frequency Range}.With compact 1 gram Syringe footprint, this component enables high-density PCB layouts. The space-saving design maintains strict dimensional tolerances for consistent RF performance in phased array applications.
Product Attributes
- Product Status: Active
- Type: Silicone Compound
- Size / Dimension: 1 gram Syringe
- Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
- Color: Gray
- Thermal Conductivity: 8.50W/m-K
- Features: -
- Shelf Life: 60 Months
- Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
You May Also Be Interested In
