T62-1-65-0.16

t-Global Technology

General info

Part Number

T62-1-65-0.16

Manufacturer

t-Global Technology

Description:

THERM PAD 65MM DIA W/ADH BLACK

Reference Price (USD)

$1.09000

500+

$1.0791

1000+

$1.0682

1500+

$1.0573

2000+

$1.0464

2500+

$1.0355

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

T62-1-65-0.16

$1.09

Product details

t-Global Technology's T62-1-65-0.16 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Graphite-Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Round configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 65.00mm Dia sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0063" (0.160mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Graphite formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.Featuring Adhesive - One Side properties, this solution offers reliable component bonding without outgassing concerns. This characteristic is critical for maintaining clean environments in precision RF assemblies.The Black coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 15W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.