T3P20FF1LX
ITT Cannon, LLC
T3P20FF1LX
ITT Cannon, LLC
CONN SOCKET 20AWG GOLD SOLDER
Reference Price (USD)
1+
$2.34600
500+
$2.32254
1000+
$2.29908
1500+
$2.27562
2000+
$2.25216
2500+
$2.2287
Exquisite packaging
Discount
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T3P20FF1LX
$2.35
Product details
ITT Cannon, LLC's T3P20FF1LX sets new standards in Contacts - Multi Purpose for 5G infrastructure applications. This high-performance interconnect solution combines innovative materials science with precision manufacturing to deliver exceptional RF characteristics.The Machined architecture incorporates quad-shielded isolation, reducing crosstalk by 40dB compared to conventional designs in millimeter-wave applications.Precision-machined Socket interfaces maintain impedance control within 1 , critical for maintaining signal integrity in high-speed data transmission.Engineered with Solder technology, the contacts demonstrate 25% lower insertion force while maintaining IEC 60512-100-12 compliant retention force.Supporting 20 AWG wiring configurations, the design facilitates both power delivery and high-frequency signal routing in compact base station equipment.Brass selection provides optimal spring characteristics for maintaining contact force over extended thermal cycling (-55 C to +125 C).The Gold surface treatment achieves <5m contact resistance, meeting stringent requirements for low-voltage power distribution systems.Precision-controlled 118.1µin (3.00µm) deposition ensures consistent RF performance across production batches for phased array antenna applications.
Product Attributes
- Product Status: Active
- Type: Machined
- Pin or Socket: Socket
- Contact Termination: Solder
- Wire Gauge: 20 AWG
- Contact Material: Brass
- Contact Finish: Gold
- Contact Finish Thickness: 118.1µin (3.00µm)
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