SVF332R3K2CKU2
NXP USA Inc.
SVF332R3K2CKU2
NXP USA Inc.
IC MCU 32BIT ROMLESS 176LQFP
Reference Price (USD)
1+
$40.02125
500+
$39.6210375
1000+
$39.220825
1500+
$38.8206125
2000+
$38.4204
2500+
$38.0201875
Exquisite packaging
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SVF332R3K2CKU2
$40.02
Product details
The SVF332R3K2CKU2 by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A5 + Cortex®-M4 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 266MHz, 133MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ MPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The LPDDR2, DDR3, DRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.Yes GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting DCU, GPU, LCD, VideoADC, VIU outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 OTG + PHY (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG include model encryption and secure model update mechanisms for protected edge AI deployments.The 176-LQFP Exposed Pad package incorporates advanced heat spreading technology for sustained AI workloads.Available in 176-HLQFP (24x24), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A5 + Cortex®-M4
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 266MHz, 133MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, DDR3, DRAM
- Graphics Acceleration: Yes
- Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
- Ethernet: 10/100Mbps (2)
- SATA: -
- USB: USB 2.0 OTG + PHY (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-HLQFP (24x24)
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