SVF311R3K1CKU2
NXP USA Inc.
SVF311R3K1CKU2
NXP USA Inc.
IC MCU 32BIT ROMLESS 176LQFP
Reference Price (USD)
1+
$43.24000
500+
$42.8076
1000+
$42.3752
1500+
$41.9428
2000+
$41.5104
2500+
$41.078
Exquisite packaging
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SVF311R3K1CKU2
$43.24
Product details
NXP USA Inc.'s SVF311R3K1CKU2 revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The ARM® Cortex®-A5 core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 266MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.The Multimedia; NEON™ MPE units accelerate OFDM processing and channel coding algorithms.High-bandwidth LPDDR2, DDR3, DRAM memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.The DCU, GPU, LCD, VideoADC, VIU interfaces support remote management consoles for network equipment.10/100Mbps (2) implementations provide the necessary throughput for CPRI and eCPRI interfaces in 5G radios.USB 2.0 OTG + PHY (1) interfaces enable flexible configuration and debugging of network equipment during deployment.3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 85°C (TA) operation, the processor maintains performance in outdoor radio unit installations.Carrier-grade ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG protect network infrastructure from both physical and cyber threats.The 176-LQFP Exposed Pad package design optimizes thermal performance for continuous high-load operation.Available in 176-HLQFP (24x24), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A5
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: LPDDR2, DDR3, DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
- Ethernet: 10/100Mbps (2)
- SATA: -
- USB: USB 2.0 OTG + PHY (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
- Package / Case: 176-LQFP Exposed Pad
- Supplier Device Package: 176-HLQFP (24x24)
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