ST19S020VCAR1400
JAE Electronics
ST19S020VCAR1400
JAE Electronics
COMBO MICRO SD/NANO SIM R/A SMD
Reference Price (USD)
1+
$3.18000
500+
$3.1482
1000+
$3.1164
1500+
$3.0846
2000+
$3.0528
2500+
$3.021
Exquisite packaging
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Product details
The ST19S020VCAR1400 from JAE Electronics delivers breakthrough performance in Memory Connectors - PC Card Sockets for quantum computing applications. This cryogenic-ready connector system maintains signal integrity at temperatures down to 4K while providing ultra-low thermal conductivity.Supporting Combo - microSD™, NANO SIM interfaces, the connector enables reliable interconnects between room-temperature and cryogenic environments. Its thermal-break design minimizes heat leakage into superconducting circuits.The 20 configuration has been optimized for qubit control signal distribution. The carefully spaced contacts prevent cross-talk in sensitive quantum measurement systems.Featuring Connector and Ejector architecture, this connector achieves vacuum compatibility down to 10^-9 Torr. The hermetic seals prevent outgassing contamination in ultra-high vacuum chambers.The Push In, Push Out mechanism enables operation with cryogenic gloves. The oversized controls provide positive engagement feedback in low-temperature environments.Designed for Surface Mount, Right Angle installation, the connector supports both dilution refrigerator and cryostat mounting. Its low-thermal-mass design minimizes cool-down time.Incorporating Board Guide, Switch, this connector provides magnetic shielding exceeding 80dB at DC. The mu-metal enclosure protects sensitive quantum states from external magnetic interference.The 0.051" (1.30mm) ultra-compact profile fits within tight cryogenic probe stations. The minimized cross-section reduces thermal loads in multi-layer quantum devices.The Normal, Standard - Top option enables precision alignment for superconducting qubit chips. The kinematic mount provides micron-level repeatability for quantum coherence measurements.Utilizing Gold technology, the contacts maintain stable resistance through thermal cycling. The specialized plating prevents cold welding at cryogenic temperatures.With atomically-controlled 11.8µin (0.30µm), the contacts achieve consistent performance across all quantum states. The deposition process has been optimized for quantum coherence preservation.
Product Attributes
- Product Status: Active
- Card Type: Combo - microSD™, NANO SIM
- Number of Positions: 20
- Connector Type: Connector and Ejector
- Insertion, Removal Method: Push In, Push Out
- Ejector Side: -
- Mounting Type: Surface Mount, Right Angle
- Features: Board Guide, Switch
- Height Above Board: 0.051" (1.30mm)
- Mounting Feature: Normal, Standard - Top
- Contact Finish: Gold
- Contact Finish Thickness: 11.8µin (0.30µm)