SPF080-1X08-998Z
Amphenol ICC (FCI)
SPF080-1X08-998Z
Amphenol ICC (FCI)
CONN SOCKET SIP 8POS TIN-LEAD
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Product details
Amphenol ICC (FCI)'s SPF080-1X08-998Z represents the next generation of Sockets for ICs, Transistors solutions, optimized for industrial IoT applications. The innovative design incorporates multiple reliability enhancements while maintaining backward compatibility with legacy systems.The SIP architecture provides unparalleled flexibility for prototype development. System designers can leverage multiple configuration options to optimize signal paths in mixed-signal circuits.Configured with 8 (1 x 8), this socket supports complex ASIC programming. The symmetrical pin distribution minimizes propagation delay variations in high-speed memory interfaces.Precision-engineered 0.100" (2.54mm) spacing prevents solder bridging during reflow. This feature is particularly valuable for miniaturized medical device manufacturing.Tin-Lead surface treatment delivers exceptional wear resistance. Accelerated aging tests show <5% contact resistance change after 1,000 thermal cycles.The 200.0µin (5.08µm) coating thickness exceeds telecom industry requirements. This ensures stable contact impedance in base station power amplifiers.The Through Hole design facilitates rapid field replacement in harsh environments. This feature reduces maintenance downtime in offshore wind turbine applications.Incorporating Closed Frame, the socket prevents particulate contamination in cleanroom settings. The unique geometry meets ISO Class 5 particulate standards.
Product Attributes
- Product Status: Obsolete
- Type: SIP
- Number of Positions or Pins (Grid): 8 (1 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin-Lead
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: -
- Mounting Type: Through Hole
- Features: Closed Frame
- Termination: -
- Pitch - Post: -
- Contact Finish - Post: -
- Contact Finish Thickness - Post: -
- Contact Material - Post: -
- Housing Material: -
- Operating Temperature: -
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