SPC5777CK2MMO3R
NXP USA Inc.
SPC5777CK2MMO3R
NXP USA Inc.
IC MCU 32BIT 8MB FLASH 516MAPBGA
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Product details
The SPC5777CK2MMO3R from NXP USA Inc. sets new standards in Embedded - Microcontrollers for building automation systems. Its multi-protocol wireless capabilities and ultra-low power architecture make it perfect for smart HVAC controls and IoT-enabled lighting systems.Featuring e200z7 technology, this microcontroller executes building control algorithms while consuming just 15 A/MHz in active mode.The 32-Bit Tri-Core architecture processes multiple sensor inputs simultaneously, enabling complex occupancy detection algorithms with 99% accuracy.Operating at 264MHz, the device maintains sub-millisecond response times for critical safety systems like smoke detection and emergency lighting control.With EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI support, the microcontroller seamlessly bridges between wired BACnet and wireless Zigbee networks in hybrid building automation systems.Integrated DMA, LVD, POR, Zipwire include precision temperature sensors and humidity measurement circuits that eliminate external components in climate control applications.8MB (8M x 8) accommodates complete KNX and DALI protocol stacks alongside application code for lighting control scenarios.The FLASH implementation enables secure over-the-air updates for field upgrades without physical access to installed devices.512K x 8 of retention memory preserves system state during power outages, ensuring immediate recovery in critical life safety systems.The 3V ~ 5.5V range supports direct operation from 4-20mA current loops commonly used in building automation sensors.Precision A/D 16b Sigma-Delta, eQADC achieve 0.5 C accuracy in temperature measurement for precise climate control in sensitive environments.The Internal maintains timing accuracy during battery operation, enabling 10-year operation from a single coin cell in wireless sensors.Rated for -40°C ~ 125°C (TA), the device operates reliably in unconditioned spaces like attics and mechanical rooms.Surface Mount packaging withstands vibration and mechanical stress encountered in HVAC equipment installations.The 516-BGA provides enhanced ESD protection for reliable operation in electrically noisy building environments.Available in 516-MAPBGA (27x27), the microcontroller is pre-certified for global building automation standards including EN 14908.
Product Attributes
- Product Status: Obsolete
- Core Processor: e200z7
- Core Size: 32-Bit Tri-Core
- Speed: 264MHz
- Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 8MB (8M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Data Converters: A/D 16b Sigma-Delta, eQADC
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 516-BGA
- Supplier Device Package: 516-MAPBGA (27x27)
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