SPC5775BDK3MME2R
NXP USA Inc.
SPC5775BDK3MME2R
NXP USA Inc.
IC MCU 32BIT 4MB FLASH 416MAPBGA
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$54.20250
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$53.660475
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$53.11845
1500+
$52.576425
2000+
$52.0344
2500+
$51.492375
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SPC5775BDK3MME2R
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Product details
NXP USA Inc.'s SPC5775BDK3MME2R sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The e200z7 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Dual-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 220MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive DMA, LVD, POR, Zipwire suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.4MB (4M x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The FLASH implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.512K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 3V, 5.5V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.Internal clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -40°C ~ 125°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.416-BGA packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 416-MAPBGA (27x27), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: e200z7
- Core Size: 32-Bit Dual-Core
- Speed: 220MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART
- Peripherals: DMA, LVD, POR, Zipwire
- Number of I/O: -
- Program Memory Size: 4MB (4M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 512K x 8
- Voltage - Supply (Vcc/Vdd): 3V, 5.5V
- Data Converters: -
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 125°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 416-BGA
- Supplier Device Package: 416-MAPBGA (27x27)
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