SP12A1G30
Amphenol Sine Systems Corp
SP12A1G30
Amphenol Sine Systems Corp
CONN PIN 12-14AWG GOLD CRIMP
Reference Price (USD)
1+
$0.75200
500+
$0.74448
1000+
$0.73696
1500+
$0.72944
2000+
$0.72192
2500+
$0.7144
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
SP12A1G30
$0.75
Product details
Amphenol Sine Systems Corp's SP12A1G30 sets new standards in Contacts - Multi Purpose for 5G infrastructure applications. This high-performance interconnect solution combines innovative materials science with precision manufacturing to deliver exceptional RF characteristics.The Signal, Stamped architecture incorporates quad-shielded isolation, reducing crosstalk by 40dB compared to conventional designs in millimeter-wave applications.Precision-machined Pin interfaces maintain impedance control within 1 , critical for maintaining signal integrity in high-speed data transmission.Engineered with Crimp technology, the contacts demonstrate 25% lower insertion force while maintaining IEC 60512-100-12 compliant retention force.Supporting 12-14 AWG wiring configurations, the design facilitates both power delivery and high-frequency signal routing in compact base station equipment.Copper Alloy selection provides optimal spring characteristics for maintaining contact force over extended thermal cycling (-55 C to +125 C).The Gold surface treatment achieves <5m contact resistance, meeting stringent requirements for low-voltage power distribution systems.Precision-controlled 30.0µin (0.76µm) deposition ensures consistent RF performance across production batches for phased array antenna applications.
Product Attributes
- Product Status: Active
- Type: Signal, Stamped
- Pin or Socket: Pin
- Contact Termination: Crimp
- Wire Gauge: 12-14 AWG
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
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